Physical quantity sensor, method of manufacturing physical quantity sensor, electronic apparatus, and vehicle

ABSTRACT

A physical quantity sensor includes: a supporting member; and a sensor element supported by the supporting member, in which the sensor element includes a vibrator element, a drive signal wiring disposed on the vibrator element, and a first detection signal terminal and a second detection signal terminal disposed on the vibrator element, the supporting member includes a substrate on which the sensor element is joined, and a first detection signal wiring and a second detection signal wiring disposed on the substrate, and the first detection signal wiring and the second detection signal wiring respectively include areas that extend along a second axis intersecting with the first axis and that intersect with the drive signal wiring in a plan view as seen in a direction in which the sensor element and the substrate overlap with each other.

CROSS-REFERENCE

The entire disclosure of Japanese Patent Application No. 2018-067111,filed Mar. 30, 2018 is expressly incorporated by reference herein.

BACKGROUND 1. Technical Field

The present disclosure relates to a physical quantity sensor, a methodof manufacturing the physical quantity sensor, an electronic apparatus,and a vehicle.

2. Related Art

As one type of physical quantity sensor, for example, a vibration typegyro sensor using a piezoelectric body such as a vibrator elementdescribed in JP-A-2010-256332 is known. The vibrator element describedin JP-A-2010-256332 includes a base portion, first and second couplingarms respectively extending from the base portion along an X axis inpositive and negative directions, first and second detection armsrespectively extending from the base portion along a Y axis orthogonalto the X axis in the positive and negative directions, first and seconddrive arms respectively extending from the first coupling arm along theY axis in the positive and negative directions, and third and fourthdrive arms respectively extending from the second coupling arm along theY axis in the positive and negative directions. Here, detection signalelectrodes in which detection signals are generated by detectionvibration are formed in the first and second detection arms and drivesignal electrodes to which drive signals for drive vibration are inputare formed in the first and second drive arms. In JP-A-2010-256332, afirst detection signal generated in the detection signal electrodeformed in the first detection arm and a second detection signalgenerated in the detection signal electrode formed in the seconddetection arm are differentially amplified to generate a differentialamplification signal and a predetermined physical quantity is detectedbased on the differential amplification signal. The vibrator element isaccommodated in a package and fixed to a package base of the package.

Meanwhile, a configuration described in JP-A-2010-256332 has a problemin that since the vibrator element is directly fixed to the packagebase, a stress such as a thermal stress generated in the package base istransmitted to the vibrator element and as a result, an output(so-called zero point output) of the detection signal when not receivingan angular velocity to be detected changes.

SUMMARY

An advantage of some aspects of the present disclosure is to provide aphysical quantity sensor capable of improving detection accuracy and amethod of manufacturing the physical quantity sensor, and to provide anelectronic apparatus and a vehicle including the physical quantitysensor.

The present disclosure can be implemented as the following applicationexamples.

A physical quantity sensor according to an application example of thepresent disclosure includes: a base; a supporting member supported bythe base; and a sensor element supported by the supporting member, inwhich the sensor element includes a vibrator element, a drive signalwiring that is disposed on the vibrator element, that transmits a drivesignal for vibrating a drive portion of the vibrator element, and thatextends along a first axis, and a first detection signal terminal and asecond detection signal terminal that are disposed on the vibratorelement and that output detection signals in accordance with vibrationof a detection portion of the vibrator element, the supporting memberincludes a substrate on which the sensor element is joined, a firstdetection signal wiring that is disposed on the substrate and thattransmits the detection signal from the first detection signal terminal,and a second detection signal wiring that is disposed on the substrateand that transmits the detection signal from the second detection signalterminal, and the first detection signal wiring and the second detectionsignal wiring respectively include areas that extend along a second axisintersecting with the first axis and that intersect with the drivesignal wiring in a plan view as seen in a direction in which the sensorelement and the substrate overlap with each other.

In the physical quantity sensor according to the application example,the area may be positioned closer to a center of the substrate than anouter edge of the substrate in the plan view.

In the physical quantity sensor according to the application example,the supporting member may include a first portion in a frame shapejoined to the base, a second portion in a frame shape disposed insidethe first portion, the substrate to which the sensor element is joinedand which is disposed inside the second portion, a first beam portionswingably supporting the second portion around a third axis with respectto the first portion, and a second beam portion swingably supporting thesubstrate around a fourth axis intersecting with the third axis withrespect to the second portion.

In the physical quantity sensor according to the application example,the supporting member may include a first portion in a frame shapejoined to the base, the substrate to which the sensor element is joinedand which is disposed inside the first portion, and a first beam portionswingably supporting the substrate around a third axis with respect tothe first portion.

In the physical quantity sensor according to the application example,the physical quantity sensor may include a metal bump joining the sensorelement and the substrate.

A method of manufacturing a physical quantity sensor according toanother application example of the present disclosure is a method ofmanufacturing a physical quantity sensor having abase, a supportingmember supported by the base, and a sensor element supported by thesupporting member, the method including: preparing the base, thesupporting member, and the sensor element; and joining the supportingmember and the sensor element, in which in the preparing, the sensorelement includes a vibrator element, a drive signal wiring that isdisposed on the vibrator element, that transmits a drive signal forvibrating a drive portion of the vibrator element, and that extendsalong a first axis, and a first detection signal terminal and a seconddetection signal terminal that are disposed on the vibrator element andthat output detection signals in accordance with vibration of adetection portion of the vibrator element, the supporting memberincludes a substrate, a first detection signal wiring that is disposedon the substrate and that transmits the detection signal from the firstdetection signal terminal, and a second detection signal wiring that isdisposed on the substrate and that transmits the detection signal fromthe second detection signal terminal, and in the joining, the firstdetection signal wiring and the second detection signal wiringrespectively include areas that extend along a second axis intersectingwith the first axis and that intersect with the drive signal wiring in aplan view as seen in a direction in which the sensor element and thesubstrate overlap with each other.

An electronic apparatus according to still another application exampleof the present disclosure includes: the physical quantity sensoraccording to the application example, in which the physical quantitysensor includes a circuit element.

A vehicle according to still another application example of the presentdisclosure includes: the physical quantity sensor according to theapplication example; and a body on which the physical quantity sensor ismounted.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating a physical quantity sensoraccording to a first embodiment.

FIG. 2 is a cross-sectional view of the physical quantity sensorillustrated in FIG. 1.

FIG. 3 is a plan view of a circuit element included in the physicalquantity sensor illustrated in FIG. 1.

FIG. 4 is a diagram illustrating a configuration example of the circuitelement.

FIG. 5 is a plan view illustrating a sensor element according to thefirst embodiment.

FIG. 6 is a plan view of an electrode pattern of the sensor elementillustrated in FIG. 5 when seen from a +Z axis direction side.

FIG. 7 is a plan view of the electrode pattern of the sensor elementillustrated in FIG. 5 when seen from a −Z axis direction side.

FIG. 8 is an enlarged plan view illustrating a drive signal wiring, anda first detection signal wiring and a second detection signal wiring ofthe sensor element illustrated in FIG. 6.

FIG. 9 is a plan view illustrating a relay substrate according to thefirst embodiment.

FIG. 10 is a plan view of an electrode pattern of the relay substrateillustrated in FIG. 9 when seen from the +Z axis direction side.

FIG. 11 is a plan view of the electrode pattern of the relay substrateillustrated in FIG. 9 when seen from the −Z axis direction side.

FIG. 12 is a diagram illustrating a positional relationship between thedrive signal wiring of the sensor element illustrated in FIG. 6 and afirst detection signal wiring and a second detection signal wiring ofthe relay substrate illustrated in FIG. 10.

FIG. 13 is a plan view illustrating a modification example of the relaysubstrate.

FIG. 14 is a plan view of an electrode pattern of a sensor elementaccording to a second embodiment when seen from the +Z axis directionside.

FIG. 15 is a plan view of the electrode pattern of the sensor elementillustrated in FIG. 14 when seen from the −Z axis direction side.

FIG. 16 is a diagram illustrating a coupling state between a firstdetection signal wiring and a second detection signal wiring, and acharge amplifier in the second embodiment.

FIG. 17 is an enlarged plan view illustrating a drive signal wiring, andthe first detection signal wiring and the second detection signal wiringof the sensor element illustrated in FIG. 14.

FIG. 18 is a plan view of an electrode pattern of a relay substrateaccording to the second embodiment when seen from the +Z axis directionside.

FIG. 19 is an enlarged plan view illustrating a drive signal wiring, anda first detection signal wiring and a second detection signal wiring ofa sensor element according to a third embodiment.

FIG. 20 is a graph illustrating a relationship between a removed widthL7 and a capacitance difference illustrated in FIG. 19.

FIG. 21 is a perspective view illustrating a configuration of a mobiletype or a notebook type personal computer which is an electronicapparatus according to the embodiment.

FIG. 22 is a perspective view illustrating a configuration of a mobilephone which is an electronic apparatus according to the embodiment.

FIG. 23 is a perspective view illustrating a configuration of a digitalstill camera which is an electronic apparatus according to theembodiment.

FIG. 24 is a perspective view illustrating an automobile which is avehicle according to the embodiment.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, a physical quantity sensor, a method of manufacturing thephysical quantity sensor, an electronic apparatus, and a vehicleaccording to the present disclosure will be described in detail based onembodiments illustrated in the accompanying drawings. Furthermore, eachof the drawings may be appropriately enlarged or reduced so as todisplay parts to be described in a recognizable state.

1. Physical Quantity Sensor 1a. First Embodiment

FIG. 1 is a perspective view illustrating a physical quantity sensoraccording to the first embodiment. FIG. 2 is a cross-sectional view ofthe physical quantity sensor illustrated in FIG. 1. FIG. 3 is a planview of a circuit element included in the physical quantity sensorillustrated in FIG. 1. FIG. 4 is a diagram illustrating a configurationexample of the circuit element.

In the following description, for convenience of description, thedescription is performed by using an X axis as an axis corresponding toa first axis of the sensor element, a Y axis as an axis corresponding toa second axis, and a Z axis as an axis corresponding to a thicknessdirection of the sensor element. That is, the description is performedby appropriately using the X axis, the Y axis, and the Z axis which arethree axes orthogonal to one another. In addition, a direction parallelto the X axis is referred to as an “X axis direction”, a directionparallel to the Y axis is referred to as a “Y axis direction”, adirection parallel to the Z axis is referred to as a “Z axis direction”,and a tip side of an arrow indicating each of the axes is “+” and a baseend side of the arrow is “−” in each of the drawings. Further, a +Z axisdirection side which is an upper side in FIG. 2 is also referred to as“upper” and a −Z axis direction side which is a lower side in FIG. 2 isalso referred to as “lower”. In addition, in the present embodiment, theX axis, the Y axis, and the Z axis respectively correspond to anelectrical axis, a mechanical axis, and an optical axis which arecrystal axes of a quartz crystal of a material of the sensor element.Further, a surface facing the +Z axis direction is referred to as “uppersurface”, a surface facing the −Z axis direction is referred to as“lower surface”, and a surface facing a direction intersecting with theZ axis is referred to as “side surface”. In addition, in FIG. 1, a lid22 is not illustrated.

A physical quantity sensor 1 illustrated in FIGS. 1 and 2 is an angularvelocity sensor for detecting an angular velocity around the Z axis. Thephysical quantity sensor 1 includes a package 2, a sensor element 3accommodated in the package 2, a circuit element 4, and a relaysubstrate 5. Here, the sensor element 3 is supported by the package 2via the relay substrate 5 which is an example of a supporting member. Inthis manner, by interposing the relay substrate 5 between the package 2and the sensor element 3, it is possible to reduce transmission of astress such as a thermal stress from the package 2 to the sensor element3. As a result, it is possible to improve detection accuracy of thephysical quantity sensor 1. Hereinafter, each of portions of thephysical quantity sensor 1 will be described in order.

Package

The package 2 includes a base 21 in a box shape having a recess portion211 and a lid 22 in a plate shape joined to the base 21 via a joiningmember 23 so as to close an opening of the recess portion 211. A spacefor accommodating the sensor element 3, the circuit element 4, and therelay substrate 5 is formed between the base 21 and the lid 22. Thespace may be a vacuum state as an example of a reduced pressure state oran inert gas such as nitrogen, helium, argon or the like may be filledin the space and the space may be sealed.

The recess portion 211 of the base 21 includes a lower stage surface 241positioned on a bottom side, an upper stage surface 243 positioned on anopening side, and a middle stage surface 242 positioned between thelower stage surface 241 and the upper stage surface 243. A componentmaterial of the base 21 is not particularly limited, and variousceramics such as aluminum oxide and various glass materials can be used,for example. In addition, a component material of the lid 22 is notparticularly limited, and may be a member having a linear expansioncoefficient close to that of the component material of the base 21, forexample. For example, in a case where the component material of the base21 is ceramics, the component material of the lid 22 may be an alloysuch as kovar or the like. In addition, for example, the joining member23 is a seal ring made of a metal material such as Kovar or the like andis joined to the base 21 by brazing or the like. The lid 22 is joined tothe base 21 by a seam welding or the like via the joining member 23.

As illustrated in FIG. 3, a plurality of terminals 261, 262, 263, 264,265, and 266 electrically coupled to the relay substrate 5 are providedon the upper stage surface 243. In addition, a plurality of terminals 25electrically coupled to the circuit element 4 are provided on the middlestage surface 242. Further, as illustrated in FIG. 2, a plurality ofexternal coupling terminals 27 are formed on a rear surface of the base21. The plurality of terminals 261, 262, 263, 264, 265, and 266, theplurality of terminals 25, and the plurality of external couplingterminals 27 are appropriately coupled by internal wirings andthrough-holes (not illustrated) formed in the base 21. A componentmaterial of these terminals is not particularly limited, and, forexample, a metal material such as gold (Au), gold alloy, platinum (Pt),aluminum (Al), aluminum alloy, silver (Ag), silver alloy, chromium (Cr),chromium alloy, nickel (Ni), copper (Cu), molybdenum (Mo), niobium (Nb),tungsten (W), iron (Fe), titanium (Ti), cobalt (Co), zinc (Zn),zirconium (Zr), or the like is used.

Shapes of the base 21 and the lid 22 in a plan view are not limited tothe illustrated shape, and may be any shapes.

Circuit Element

As illustrated in FIG. 2, the circuit element 4 is fixed to the lowerstage surface 241 of the base 21 by an adhesive 11. As illustrated inFIG. 3, the circuit element 4 includes a plurality of terminals 41, andeach of the terminals 41 is electrically coupled to each of the terminal25 of the package 2 described above by a conductive wire B1. Asillustrated in FIG. 4, the circuit element 4 includes a drive circuit440 which generates a drive signal for drive vibration of the sensorelement 3 and a detection circuit 450 which detects an angular velocityω based on a detection signal outputted from the sensor element 3.Hereinafter, the drive circuit 440 and the detection circuit 450 will bedescribed in detail.

The drive circuit 440 is a circuit for inputting a drive signal fordrive vibration of the sensor element 3 to a drive signal electrode 371a of the sensor element 3 to be described below. The drive circuit 440includes an I/V conversion circuit 441 which is a current/voltageconversion circuit, an AC amplification circuit 442, and an amplitudeadjustment circuit 443.

The I/V conversion circuit 441 is electrically coupled to a drive fixedpotential electrode 372 a of the sensor element 3 to be described belowand converts an input alternating current into an alternating currentvoltage signal and outputs the resultant signal. Here, an alternatingcurrent generated by a piezoelectric effect is input to the I/Vconversion circuit 441 in accordance with vibration of drive arms 316,317, 318, and 319 of the sensor element 3 to be described below.Therefore, the I/V conversion circuit 441 outputs an alternating currentvoltage signal having the same frequency as a vibration frequency of thevibration of the drive arms 316, 317, 318, and 319. The alternatingcurrent voltage signal output from the I/V conversion circuit 441 isinput to the AC amplification circuit 442.

The AC amplification circuit 442 amplifies and outputs the inputalternating current voltage signal. The alternating current voltagesignal output from the AC amplification circuit 442 is input to theamplitude adjustment circuit 443.

The amplitude adjustment circuit 443 controls a gain so as to hold theamplitude of the input alternating current voltage signal at a constantvalue and outputs an alternating current voltage signal after gaincontrol. The alternating current voltage signal output from theamplitude adjustment circuit 443 is input to the drive signal electrode371 a of the sensor element 3 as a drive signal. Accordingly, the drivearms 316, 317, 318, and 319 vibrate.

The detection circuit 450 differentially amplifies a first detectionsignal and a second detection signal to be described below to generate adifferential amplification signal and detects the angular velocity ωbased on the differential amplification signal. By using thedifferential amplification signal as described above, it is possible toimprove detection sensitivity by cancelling at least a part of a noiseincluded in the first detection signal and a noise included in thesecond detection signal. The detection circuit 450 includes a chargeamplifier 451, a charge amplifier 452, a differential amplificationcircuit 453, an AC amplification circuit 454, a synchronous detectioncircuit 455, a smoothing circuit 456, a variable amplification circuit457, and a filter circuit 458.

The charge amplifier 451 is electrically coupled to a first detectionsignal electrode 373 a of the sensor element 3 to be described below andconverts an input alternating current into an alternating currentvoltage signal and outputs the resultant signal. Here, the alternatingcurrent output from the first detection signal electrode 373 a of thesensor element 3 to be described below is input to the charge amplifier451 as a first detection signal. In the same manner, the chargeamplifier 452 is electrically coupled to a second detection signalelectrode 375 a of the sensor element 3 to be described below andconverts an input alternating current into an alternating currentvoltage signal and outputs the resultant signal. Here, the alternatingcurrent output from the second detection signal electrode 375 a of thesensor element 3 to be described below is input to the charge amplifier452 as a second detection signal. In addition, the first detectionsignal and the second detection signal have opposite phases from eachother. The alternating current voltage signals output from the chargeamplifiers 451 and 452 are respectively input to the differentialamplification circuit 453.

The differential amplification circuit 453 differentially amplifies thealternating current voltage signal output from the charge amplifier 451and the alternating current voltage signal output from the chargeamplifier 452 to generate a differential amplification signal andoutputs the differential amplification signal. The differentialamplification signal output from the differential amplification circuit453 is input to the AC amplification circuit 454.

The AC amplification circuit 454 amplifies the differentialamplification signal output from the differential amplification circuit453 and outputs the resultant differential amplification signal as analternating current voltage signal. The alternating current voltagesignal output from the AC amplification circuit 454 is input to thesynchronous detection circuit 455.

The synchronous detection circuit 455 synchronously detects thealternating current voltage signal output from the AC amplificationcircuit 454 based on the alternating current voltage signal output fromthe AC amplification circuit 442 of the drive circuit 440 describedabove and extracts an angular velocity component. A signal of theangular velocity component extracted by the synchronous detectioncircuit 455 is smoothed into a direct current voltage signal by thesmoothing circuit 456 and input to the variable amplification circuit457.

The variable amplification circuit 457 amplifies or attenuates thedirect current voltage signal output from the smoothing circuit 456 witha set amplification factor or attenuation factor to change angularvelocity sensitivity. The signal amplified or attenuated by the variableamplification circuit 457 is input to the filter circuit 458.

The filter circuit 458 attenuates a high frequency noise componentoutside a sensor bandwidth from the signal output from the variableamplification circuit 457 to a predetermined level or less and outputs adetection signal of polarity and a voltage level according to adirection and magnitude of the angular velocity. The detection signal isoutput from an external output terminal (not illustrated) to an outside.

Vibration Element

FIG. 5 is a plan view illustrating a sensor element according to thefirst embodiment. FIG. 6 is a plan view of an electrode pattern of thesensor element illustrated in FIG. 5 when seen from a +Z axis directionside. FIG. 7 is a plan view of the electrode pattern of the sensorelement illustrated in FIG. 5 when seen from a −Z axis direction side.FIG. 8 is an enlarged plan view illustrating a drive signal wiring, anda first detection signal wiring and a second detection signal wiring ofthe sensor element illustrated in FIG. 6. In FIG. 5, for convenience ofdescription, an electrode pattern 37 is not illustrated.

The sensor element 3 illustrated in FIG. 5 is a sensor element fordetecting the angular velocity ω around the Z axis. The sensor element 3includes a vibrator element 30 and the electrode pattern 37 provided ona surface of the vibrator element 30.

The vibrator element 30 includes a spread in an xy plane defined by they axis as a mechanical axis which is a crystal axis of a quartz crystalsubstrate and the x axis as an electrical axis and has a plate shapehaving a thickness in a direction along the z axis as an optical axis.That is, the vibrator element 30 is configured by a z-cut quartz crystalplate. The z axis does not have to coincide with the thickness directionof the vibrator element 30, but the z axis may be slightly tilted withrespect to the thickness direction in view of reducing a frequencychange according to a temperature in the vicinity of an ordinarytemperature. Specifically, the z-cut quartz crystal plate includes aquartz crystal plate of a cut angle so that a surface obtained byrotating a surface orthogonal to the z axis around at least one of the xaxis and the y axis within a range from 0° or more to 10° or less is amain surface. A material of the vibrator element 30 is not limited toquartz crystal, but a piezoelectric material other than the quartzcrystal, such as Lithium Tantalate and Lithium Niobate can also be used,for example. In addition, the vibrator element 30 may be made of siliconor the like not having a piezoelectric property, and in this case, apiezoelectric element may be appropriately provided on the vibratorelement 30.

The vibrator element 30 has a structure referred to as a so-calleddouble T type. That is, the vibrator element 30 includes a base portion311, a pair of detection arms 312 and 313 extending from the baseportion 311 to both sides in the Y axis direction, a pair of couplingarms 314 and 315 expending from the base portion 311 to both sides inthe X axis direction, a pair of drive arms 316 and 317 extending from atip portion of the coupling arm 314 to both sides in the Y axisdirection, and a pair of drive arms 318 and 319 extending from a tipportion of the coupling arm 315 to both sides in the Y axis direction.Further, the vibrator element 30 includes a pair of supporting portions321 and 322 for supporting the base portion 311, a pair of beam portions323 and 324 for coupling the supporting portion 321 and the base portion311, and a pair of beam portions 325 and 326 for coupling the supportingportion 322 and the base portion 311. Here, a base portion coupling body310 is configured to include the base portion 311 and the coupling arms314 and 315.

In addition, as illustrated, each of the detection arms 312, 313 and thedrive arms 316, 317, 318, 319 has a shape having an arm portion of aconstant width and a wide portion coupled to a tip of the arm portionand having a widened width, but each of the detection arms 312, 313 andthe drive arms 316, 317, 318, 319 is not limited thereto and may beconfigured only by an arm portion of a constant width. Further, each ofthe detection arms 312 and 313 and the drive arms 316, 317, 318, and 319may have a configuration in which a pair of bottomed grooves opening onan upper surface and a lower surface of each of the detection arms 312and 313 and the drive arms 316, 317, 318, and 319 and extending in the Yaxis direction are formed.

As illustrated in FIGS. 6 and 7, the electrode pattern 37 includes thedrive signal electrode 371 a, the drive fixed potential electrode 372 a,the first detection signal electrode 373 a, a first fixed potentialelectrode 374 a, the second detection signal electrode 375 a, a secondfixed potential electrode 376 a, a drive signal terminal 371 b, a drivefixed potential terminal 372 b, a first detection signal terminal 373 b,a first fixed potential terminal 374 b, a second detection signalterminal 375 b, a second fixed potential terminal 376 b, a drive signalwiring 371 c, a drive fixed potential wiring 372 c, a first detectionsignal wiring 373 c, a first fixed potential wiring 374 c, a seconddetection signal wiring 375 c, a second fixed potential wiring 376 c.

The drive signal electrode 371 a is an electrode for exciting drivevibration of the drive arms 316, 317, 318, and 319. The drive signalelectrodes 371 a are respectively provided on upper and lower surfacesof arm portions of the drive arms 316 and 317 and are respectivelyprovided on both side surfaces of arm portions of the drive arms 318 and319. The drive signal electrode 371 a is coupled to the drive signalterminal 371 b via the drive signal wiring 371 c. Here, the drive signalterminal 371 b is provided, on a right side part in FIG. 7, on a lowersurface of the supporting portion 321. In addition, the drive signalwiring 371 c is provided along the base portion 311, the coupling arms314 and 315, and the beam portion 324.

On the other hand, the drive fixed potential electrode 372 a has aground potential which is an example of a reference potential for thedrive signal electrode 371 a. The drive fixed potential electrodes 372 aare respectively provided on both side surfaces of the arm portions ofthe drive arms 316 and 317 and are respectively provided on upper andlower surfaces of the arm portions of the drive arms 318 and 319. Thedrive fixed potential electrode 372 a is coupled to the drive fixedpotential terminal 372 b via the drive fixed potential wiring 372 c.Here, the drive fixed potential terminal 372 b is provided, on the rightside part in FIG. 7, on a lower surface of the supporting portion 322.In addition, the drive fixed potential wiring 372 c is provided alongthe base portion 311, the coupling arms 314 and 315, and the beamportion 326.

The first detection signal electrode 373 a and the second detectionsignal electrode 375 a are electrodes for detecting a charge generatedby detection vibration of the detection arms 312 and 313 when thedetection vibration of the detection arms 312 and 313 is excited.

In the present embodiment, the first detection signal electrode 373 a isprovided on upper and lower surfaces of an arm portion of the detectionarm 312 and outputs the charge generated by the detection vibration ofthe detection arm 312 as a first detection signal. The first detectionsignal electrode 373 a is coupled to the first detection signal terminal373 b via the first detection signal wiring 373 c. Here, the firstdetection signal terminal 373 b is provided, on a left side part in FIG.7, on the lower surface of the supporting portion 321. In addition, thefirst detection signal wiring 373 c is provided along the base portion311 and the beam portion 323.

In addition, the second detection signal electrode 375 a is provided onupper and lower surfaces of an arm portion of the detection arm 313 andoutputs the charge generated by the detection vibration of the detectionarm 313 as a second detection signal. The second detection signalelectrode 375 a is coupled to the second detection signal terminal 375 bvia the second detection signal wiring 375 c. Here, the second detectionsignal terminal 375 b is provided, on the left side part in FIG. 7, onthe lower surface of the supporting portion 322. In addition, the seconddetection signal wiring 375 c is provided along the base portion 311 andthe beam portion 325.

On the other hand, the first fixed potential electrode 374 a and thesecond fixed potential electrode 376 a have ground potentials which areexamples of reference potentials for the first detection signalelectrode 373 a and the second detection signal electrode 375 a.

The first fixed potential electrodes 374 a are provided on both sidesurfaces of the arm portion of the detection arm 312. The first fixedpotential electrode 374 a is coupled to the first fixed potentialterminal 374 b via the first fixed potential wiring 374 c. Here, thefirst fixed potential terminal 374 b is provided, on a middle part inFIG. 7, on the lower surface of the supporting portion 321. In addition,the first fixed potential wiring 374 c is provided along the baseportion 311 and the beam portions 323 and 324.

Further, the second fixed potential electrodes 376 a are provided onboth side surfaces of the arm portion of the detection arm 313. Thesecond fixed potential electrode 376 a is coupled to the second fixedpotential terminal 376 b via the second fixed potential wiring 376 c.Here, the second fixed potential terminal 376 b is provided, on themiddle part in FIG. 7, on the lower surface of the supporting portion322. In addition, the second fixed potential wiring 376 c is providedalong the base portion 311 and the beam portions 325 and 326.

A component material of the electrode pattern 37 is not particularlylimited as long as the component material has conductivity. For example,the electrode pattern 37 can be configured by a metal film, on whicheach of films such as Ni (nickel), Au (gold), Ag (silver), Cu (copper),and the like is laminated, with a metallization layer of Cr (chromium),W (tungsten), or the like as an underlayer.

In the electrode pattern 37, as illustrated in FIG. 8, shapes of thefirst detection signal wiring 373 c and the second detection signalwiring 375 c are different from line symmetrical shapes based on a linesegment X1 (first axis). Here, as compared with a case where the shapesof the first detection signal wiring 373 c and the second detectionsignal wiring 375 c are the line symmetrical shapes based on the linesegment X1 (first axis), the shapes of the first detection signal wiring373 c and the second detection signal wiring 375 c are adjusted so as toreduce a difference of a capacity (hereinafter, also simply referred toas “first capacity”) between the drive signal wiring 371 c and the firstdetection signal wiring 373 c and a capacity (hereinafter, also simplyreferred to as “second capacity”) between the drive signal wiring 371 cand the second detection signal wiring 375 c. Accordingly, it ispossible to reduce a difference between magnitude of a noise mixed fromthe drive signal wiring 371 c with the first detection signal wiring 373c and magnitude of a noise mixed from the drive signal wiring 371 c withthe second detection signal wiring 375 c. Hereinafter, this point willbe described in detail below. Note that “capacity” in the presentdisclosure indicates a capacitance.

As illustrated in FIG. 8, the drive signal wiring 371 c is disposed onthe base portion 311, mainly along the line segment X1 (first axis)passing through a center G of the base portion 311 which is arectangular shape parallel to the X axis. In the present embodiment, onthe base portion 311, the drive signal wiring 371 c includes a portion(hereinafter, also referred to as “constant width portion”) having aline symmetrical shape based on the line segment X1, extending with aconstant width in the X axis direction in a plan view. In FIG. 8, anarea surrounded by a chain double-dashed line is the base portion 311.

Meanwhile, since the drive signal wiring 371 c is withdrawn onto thebeam portion 324 as described above, an entire shape of the drive signalwiring 371 c is not line symmetrical based on the line segment X1 in aplan view. Here, the drive signal wiring 371 c is withdrawn from thebase portion 311 onto the beam portion 324 closer to the first detectionsignal wiring 373 c than the second detection signal wiring 375 c. Forthis reason, if the shapes of the first detection signal wiring 373 cand the second detection signal wiring 375 c are the line symmetricalshapes based on the line segment X1, the first capacity which is thecapacity between the drive signal wiring 371 c and the first detectionsignal wiring 373 c becomes larger than the second capacity which is thecapacity between the drive signal wiring 371 c and the second detectionsignal wiring 375 c.

In the constant width portion of the drive signal wiring 371 c, thefirst detection signal wiring 373 c is disposed, on an upper side inFIG. 8, on one side and the second detection signal wiring 375 c isdisposed, on a lower side in FIG. 8, on the other side.

The first detection signal wiring 373 c and the second detection signalwiring 375 c are respectively separated apart from the drive signalwiring 371 c on the base portion 311 and have portions extending in theX axis direction in a plan view. Here, a width W1 which is a length of afirst detection signal wiring extension portion 373 c 1 in the Y axisdirection which is a portion extending along the X axis direction of thefirst detection signal wiring 373 c on the base portion 311 is smallerthan a width W2 which is a length of a second detection signal wiringextension portion 375 c 1 in the Y axis direction which is a portionextending along the X axis direction of the second detection signalwiring 375 c on the base portion 311. Accordingly, a distance L1 betweenthe constant width portion of the drive signal wiring 371 c and thefirst detection signal wiring 373 c becomes larger than a distance L2between the constant width portion of the drive signal wiring 371 c andthe second detection signal wiring 375 c. For this reason, in order tocancel or reduce a capacitance difference caused by asymmetry of theshape of the drive signal wiring 371 c described above, it is possibleto make a capacity between the constant width portion of the drivesignal wiring 371 c and the first detection signal wiring 373 c smallerthan a capacity between the constant width portion of the drive signalwiring 371 c and the second detection signal wiring 375 c. As a result,it is possible to reduce a difference between the first capacity and thesecond capacity.

In addition, between the drive signal wiring 371 c and the firstdetection signal wiring 373 c, the first fixed potential wiring 374 c isdisposed on the base portion 311 so as to be separated from thesewirings and fill in a gap between these wirings. In a same manner,between the drive signal wiring 371 c and the second detection signalwiring 375 c, the second fixed potential wiring 376 c is disposed on thebase portion 311 so as to be separated from these wirings and fill in agap between these wirings. Here, a width W3 which is a length of a firstfixed potential wiring extension portion 374 c 1 in the Y axis directionwhich is a portion of the first fixed potential wiring 374 c between thedrive signal wiring 371 c and the first detection signal wiring 373 c onthe base portion 311 is larger than a width W4 which is a length of asecond fixed potential wiring extension portion 376 c 1 in the Y axisdirection which is a portion of the second fixed potential wiring 376 cbetween the drive signal wiring 371 c and the second detection signalwiring 375 c on the base portion 311. Accordingly, it is possible tomake an electromagnetic shielding property between the constant widthportion of the drive signal wiring 371 c and the first detection signalwiring 373 c higher than an electromagnetic shielding property betweenthe constant width portion of the drive signal wiring 371 c and thesecond detection signal wiring 375 c. For this reason, also in thisconfiguration, it is possible to make the capacity between the constantwidth portion of the drive signal wiring 371 c and the first detectionsignal wiring 373 c smaller than the capacity between the constant widthportion of the drive signal wiring 371 c and the second detection signalwiring 375 c.

Returning to FIG. 5, in the sensor element 3, by inputting a drivesignal to the drive signal terminal 371 b in a state in which theangular velocity ω is not applied to the sensor element 3, when anelectric field occurs between the drive signal electrode 371 a and thedrive fixed potential electrode 372 a, each of the drive arms 316, 317,318, and 319 performs flexural vibration in a direction indicated by anarrow C in FIG. 5 as drive vibration. At this time, since the drive arms316 and 317 and the drive arms 318 and 319 perform vibration ofbilateral symmetry in FIG. 5, the base portion 311 and the detectionarms 312 and 313 hardly vibrate.

When the angular velocity ω around a central axis a along the Z axis isapplied to the sensor element 3 in a state where the drive vibration isperformed, the detection vibration is excited. Specifically, a Coriolisforce in a direction indicated by an arrow D in FIG. 5 is applied to thedrive arms 316, 317, 318, and 319 and the coupling arms 314 and 315, andnew vibration is excited. As a result, detection vibration in adirection indicated by an arrow E in FIG. 5 is excited on the detectionarms 312 and 313 so as to cancel the vibration of the coupling arms 314and 315. A charge generated by the detection vibration in the detectionarms 312 and 313 is obtained as a detection signal from the firstdetection signal electrode 373 a and the second detection signalelectrode 375 a, and the angular velocity ω is obtained based on thedetection signal.

As described above, the sensor element 3 includes the base portion 311,the drive arms 316, 317, 318, and 319 coupled from the base portion 311via the coupling arms 314 and 315 extending over the line segment X1 asthe first axis in a plan view of the base portion 311 in a thicknessdirection, the detection arm 312 as a first detection arm extending inthe +Y axis direction as a positive direction of the second axisorthogonal to the first axis in a plan view from the base portion 311and the detection arm 313 as a second detection arm extending in the −Yaxis direction as a negative direction of the second axis, the drivesignal wiring 371 c disposed on the base portion 311 in a plan view, thefirst detection signal wiring 373 c disposed on the base portion 311 ina plan view, and the second detection signal wiring 375 c disposed onthe base portion 311 in a plan view.

Here, the drive signal wiring 371 c is disposed on the base portion 311along the line segment X1 in a plan view and transmits a drive signalfor vibrating the drive arms 316, 317, 318, and 319. The first detectionsignal wiring 373 c transmits the detection signal output in accordancewith vibration of the detection arm 312 as the first detection arm. Thesecond detection signal wiring 375 c transmits the detection signaloutput in accordance with vibration of the detection arm 313 as thesecond detection arm.

The shapes of the first detection signal wiring 373 c and the seconddetection signal wiring 375 c are different from line symmetrical shapesbased on the line segment X1 as the first axis in a plan view so as toreduce a difference of the first capacity between the drive signalwiring 371 c and the first detection signal wiring 373 c and the secondcapacity between the drive signal wiring 371 c and the second detectionsignal wiring 375 c.

According to the sensor element 3, since the shapes of the firstdetection signal wiring 373 c and the second detection signal wiring 375c are different from line symmetrical shapes based on the line segmentX1 in a plan view so as to reduce the difference between the firstcapacity and the second capacity, it is possible to reduce a differencebetween the magnitude of the noise mixed from the drive signal wiring371 c with the first detection signal wiring 373 c and the magnitude ofthe noise mixed from the drive signal wiring 371 c with the seconddetection signal wiring 375 c. For this reason, the detection circuit450 differentially amplifies the first detection signal output from thefirst detection signal wiring 373 c and the second detection signaloutput from the second detection signal wiring 375 c by using thedifferential amplification circuit 453 which is a simple circuit, it ispossible to cancel or reduce a noise included in these detectionsignals. As a result, it is possible to increase an S/N ratio and toprovide the sensor element 3 with high accuracy.

Here, the first detection signal wiring 373 c includes the firstdetection signal wiring extension portion 373 c 1 which is coupled tothe first detection signal electrode 373 a disposed on the detection arm312 as the first detection arm and which extents along the line segmentX1 as the first axis on the base portion 311. The second detectionsignal wiring 375 c includes the second detection signal wiringextension portion 375 c 1 which is coupled to the second detectionsignal electrode 375 a disposed on the detection arm 313 as the seconddetection arm and which extents along the line segment X1 as the firstaxis on the base portion 311. In this manner, by withdrawing the firstdetection signal wiring 373 c and the second detection signal wiring 375c from the different detection arms onto the base portion 311, the drivesignal wiring 371 c is positioned between the first detection signalwiring 373 c and the second detection signal wiring 375 c on the baseportion 311. For this reason, by adjusting widths or lengths of thesedetection signal wirings, it is possible to reduce the differencebetween the first capacity and the second capacity.

In the present embodiment, the distance L1 between the drive signalwiring 371 c and the first detection signal wiring extension portion 373c 1 and the distance L2 between the drive signal wiring 371 c and thesecond detection signal wiring extension portion 375 c 1 are differentfrom each other. In the present embodiment, the distance L1 is largerthan the distance L2. Accordingly, it is possible to adjust thedifference between the first capacity and the second capacity.

In addition, the drive signal wiring 371 c has a line symmetrical shapebased on the line segment X1 as the first axis in an area between thefirst detection signal wiring 373 c and the second detection signalwiring 375 c in a plan view. Accordingly, it becomes easy to design thedrive signal wiring 371 c, the first detection signal wiring 373 c, andthe second detection signal wiring 375 c.

Further, the sensor element 3 includes the first fixed potential wiring374 c coupled to a fixed potential and the second fixed potential wiring376 c coupled to a fixed potential. The first fixed potential wiring 374c includes the first fixed potential wiring extension portion 374 c 1which is coupled to the first fixed potential electrode 374 a disposedon the detection arm 312 as the first detection arm and which extentsalong the line segment X1 as the first axis on the base portion 311. Thesecond fixed potential wiring 376 c includes the second fixed potentialwiring extension portion 376 c 1 which is coupled to the second fixedpotential electrode 376 a disposed on the detection arm 313 as thesecond detection arm and which extents along the line segment X1 as thefirst axis on the base portion 311. Shapes of the first fixed potentialwiring extension portion 374 c 1 and the second fixed potential wiringextension portion 376 c 1 are different from line symmetrical shapesbased on the line segment X1 as the first axis in a plan view.Accordingly, it is possible to adjust the difference between the firstcapacity and the second capacity by making the electromagnetic shieldingproperty of these fixed potential wires different.

In the present embodiment, the first fixed potential wiring extensionportion 374 c 1 includes a first portion positioned between the drivesignal wiring 371 c and the first detection signal wiring extensionportion 373 c 1 on the base portion 311. The second fixed potentialwiring extension portion 376 c 1 includes a second portion positionedbetween the drive signal wiring 371 c and the second detection signalwiring extension portion 375 c 1 on the base portion 311. The width 3 wof the first portion and the width 4 w of the second portion aredifferent from each other. Since the widths of the first portion and thesecond portion are different from each other, it is possible to easilyadjust the difference between the first capacity and the secondcapacity. As the third embodiment to be described below, since lengthsof the first portion and the second portion are different from eachother, it is possible to easily adjust the difference between the firstcapacity and the second capacity. That is, as long as the first fixedpotential wiring 374 c and the second fixed potential wiring 376 c areformed so that at least one of that the width 3 w of the first portionand the width 4 w of the second portion are different from each other orthat a length of the first portion and a length of the second portionare different from each other is satisfied, the effect described abovecan be obtained.

In addition, the physical quantity sensor 1 includes the sensor element3 and the circuit element 4 as a control circuit which outputs a drivesignal to the sensor element 3 and to which a detection signal is input.According to the physical quantity sensor 1, since the physical quantitysensor 1 has the sensor element 3 with high sensitivity, it is possibleto provide the physical quantity sensor 1 with high sensitivity.

Relay Substrate

FIG. 9 is a plan view illustrating a relay substrate according to thefirst embodiment. FIG. 10 is a plan view of an electrode pattern of therelay substrate illustrated in FIG. 9 when seen from the +Z axisdirection side. FIG. 11 is a plan view of the electrode pattern of therelay substrate illustrated in FIG. 9 when seen from the −Z axisdirection side. FIG. 12 is a diagram illustrating a positionalrelationship between the drive signal wiring of the sensor elementillustrated in FIG. 6 and a first detection signal wiring and a seconddetection signal wiring of the relay substrate illustrated in FIG. 10.FIG. 13 is a plan view illustrating a modification example of the relaysubstrate.

As illustrated in FIGS. 9 to 11, the relay substrate 5, which is anexample of a supporting member, includes a substrate 50 and an electrodepattern 57 provided on the substrate 50.

As illustrated in FIG. 9, the substrate 50 has a gimbal shape. That is,the substrate 50 includes a first portion 51 in a frame shape, a secondportion 52 in a frame shape disposed inside the first portion 51, athird portion 53 which is a substrate disposed inside the second portion52, a pair of first beam portions 54 which swingably support the secondportion 52 around an axis a1 parallel to the X axis from the firstportion 51, and a pair of second beam portions 55 which swingablysupport the third portion 53 around an axis a2 parallel to the Y axisfrom the second portion 52. Here, the first portion 51, the secondportion 52, the third portion 53, the first beam portion 54, and thesecond beam portion 55 are integrally configured.

In a plan view, the first portion 51 has a rectangular shape of whichouter and inner peripheries are in the Y axis direction as alongitudinal direction and is disposed to overlap with the plurality ofterminals 261, 262, 263, 264, 265, and 266 of the package 2 illustratedin FIG. 3 described above. In a plan view, the second portion 52 has ashape of which an outer periphery and an inner periphery are along theinner periphery of the first portion 51, that is, a rectangular shapeand is disposed to be separated from the first portion 51, inside thefirst portion 51. In a plan view, the third portion 53 has a shape ofwhich an outer periphery is along the inner periphery of the secondportion 52, that is, a rectangular shape and is disposed to be separatedfrom the second portion 52, inside the second portion 52. In a planview, the first beam portion 54 is disposed between the first portion 51and the second portion 52 to be a shape extending along the axis a1 andcouples the first portion 51 and the second portion 52. In a plan view,the second beam portion 55 is disposed between the second portion 52 andthe third portion 53 to be a shape extending along the axis a2 andcouples the second portion 52 and the third portion 53.

In this substrate 50, the second portion 52 is swingable around the axisa1 from the first portion 51 according to elastic deformation of thefirst beam portion 54 and the third portion 53 is swingable around theaxis a2 from the second portion 52 according to elastic deformation ofthe second beam portion 55. Therefore, the third portion 53 is swingablearound both axes of the axis a1 and the axis a2 from the first portion51.

A shape of each part of the substrate 50 is not limited to theillustrated shape. For example, the outer periphery and the innerperiphery of the first portion 51, the second portion 52, and the thirdportion 53 in a plan view may respectively have other polygonal shapessuch as a square shape, a hexagonal shape, and the like. In addition,each of the first beam portion 54 and the second beam portion 55 mayhave a bent or branched portion in a middle or may be disposed at aposition shifted from the axis a1 or the axis a2. Further, the substrate50 may not have a gimbal shape. For example, as illustrated in FIG. 13,the substrate 50 may have one plate shape in which the second beamportion 55 described above is omitted and the second portion 52 and thethird portion 53 are integrated or may be a single plate.

A component material of the substrate 50 is not particularly limited,and a material having a coefficient of linear expansion close to that ofthe component material of the vibrator element 30 of the sensor element3 may be used, specifically, quartz crystal may be used. Accordingly, itis possible to reduce a stress generated in the sensor element 3 due toa difference in a coefficient of linear expansion between the vibratorelement 30 and the substrate 50. Specifically, in a case where thesubstrate 50 is configured by quartz crystal, the substrate 50 mayinclude a spread in the xy plane defined by the Y axis as a mechanicalaxis which is a crystal axis of a quartz crystal substrate and the Xaxis as an electrical axis and may have a plate shape having a thicknessin a direction along the Z axis as an optical axis. That is, thesubstrate 50 may be configured by a z-cut quartz crystal plate.Accordingly, it is possible to easily obtain the substrate 50 havinghigh dimensional accuracy by using wet etching. The z-cut quartz crystalplate includes a quartz crystal plate of a cut angle so that a surfaceobtained by rotating a surface orthogonal to the Z axis around at leastone of the X axis and the Y axis within a range from 0° to 10° is a mainsurface.

The electrode pattern 57 is provided on a surface of the substrate 50.As illustrated in FIGS. 10 and 11, the electrode pattern 57 includes adrive signal terminal 571 a, a drive fixed potential terminal 572 a, afirst detection signal terminal 573 a, a first fixed potential terminal574 a, a second detection signal terminal 575 a, and a second fixedpotential terminal 576 a disposed on an upper surface of the thirdportion 53 of the substrate 50, a drive signal terminal 571 b, a drivefixed potential terminal 572 b, a first detection signal terminal 573 b,a first fixed potential terminal 574 b, a second detection signalterminal 575 b, and the second fixed potential terminal 576 b providedon a lower surface of the first portion 51 of the substrate 50, and adrive signal wiring 571 c, the drive fixed potential wiring 572 c, afirst detection signal wiring 573 c, a fixed potential wiring 574 c, anda second detection signal wiring 575 c appropriately coupling theterminals on a side of the upper surface and aside of the lower surfaceof the substrate 50.

The drive signal terminal 571 a, the drive fixed potential terminal 572a, the first detection signal terminal 573 a, the first fixed potentialterminal 574 a, the second detection signal terminal 575 a, the secondfixed potential terminal 576 a are disposed at positions correspondingto the drive signal terminal 371 b, the drive fixed potential terminal372 b, the first detection signal terminal 373 b, the first fixedpotential terminal 374 b, the second detection signal terminal 375 b,and the second fixed potential terminal 376 b of the sensor element 3described above and are respectively coupled to the correspondingterminals via a joining material 61 illustrated in FIG. 2. As thejoining material 61, any material may be used as long as the materialhas conductivity and can join the terminals to each other, and aconductive adhesive may be used, but a metal bump may be used asdescribed below.

On the other hand, the drive signal terminal 571 b, the drive fixedpotential terminal 572 b, the first detection signal terminal 573 b, thefirst fixed potential terminal 574 b, the second detection signalterminal 575 b, and the second fixed potential terminal 576 b aredisposed at positions corresponding to the terminals 261, 262, 263, 264,265, and 266 of the package 2 described above and are respectivelycoupled to the corresponding terminals via a joining material 62illustrated in FIG. 2. As the joining material 62, any material may beused as long as the material has conductivity and can join joining theterminals to each other, and a conductive adhesive may be used and ametal bump may be used.

The drive signal wiring 571 c couples the drive signal terminal 571 aand the drive signal terminal 571 b. The drive signal wiring 571 c isled from above the third portion 53 onto the first portion 51 via uppersides of the second beam portion 55 and the second portion 52 on anupper side in FIG. 10 and an upper side of the first beam portion 54 ona left side in FIG. 10. Here, the drive signal wiring 571 c is disposedon an upper surface of the substrate 50 except for a coupled part withthe drive signal terminal 571 b, and is not disposed on a lower surfaceof the substrate 50.

On the other hand, the drive fixed potential wiring 572 c couples thedrive fixed potential terminal 572 a and the drive fixed potentialterminal 572 b. The drive fixed potential wiring 572 c is led from abovethe third portion 53 onto the first portion 51 via upper sides of thesecond beam portion 55 and the second portion 52 on a lower side in FIG.10 and an upper side of the first beam portion 54 on a left side in FIG.10. Here, the drive fixed potential wiring 572 c is disposed on theupper surface of the substrate 50 except for a coupled part with thedrive fixed potential terminal 572 b, and is not disposed on the lowersurface of the substrate 50.

The first detection signal wiring 573 c couples the first detectionsignal terminal 573 a and the first detection signal terminal 573 b. Thefirst detection signal wiring 573 c is led from above the third portion53 onto the first portion 51 via upper sides of the second beam portion55 and the second portion 52 on a lower side in FIG. 10 and an upperside of the first beam portion 54 on a right side in FIG. 10. In thismanner, by passing the first detection signal wiring 573 c over thefirst beam portion 54 and the second beam portion 55 different from thedrive signal wiring 571 c, it is possible to reduce a noise being mixedfrom the drive signal wiring 571 c with the first detection signalwiring 573 c. Here, the first detection signal wiring 573 c is disposedon the upper surface of the substrate 50 except for a coupled part withthe first detection signal terminal 573 b, and is not disposed on thelower surface of the substrate 50. In addition, the first detectionsignal wiring 573 c includes a portion 573 d extending in the Y axisdirection on the third portion 53.

In the same manner, the second detection signal wiring 575 c couples thesecond detection signal terminal 575 a and the second detection signalterminal 575 b. The second detection signal wiring 575 c is led fromabove the third portion 53 onto the first portion 51 via upper sides ofthe second beam portion 55 and the second portion 52 on a lower side inFIG. 10 and an upper side of the first beam portion 54 on a right sidein FIG. 10. In this manner, by passing the second detection signalwiring 575 c over the first beam portion 54 and the second beam portion55 different from the drive signal wiring 571 c, it is possible toreduce a noise being mixed from the drive signal wiring 571 c with thesecond detection signal wiring 575 c. Here, the second detection signalwiring 575 c is disposed on the upper surface of the substrate 50 exceptfor a coupled part with the second detection signal terminal 575 b, andis not disposed on the lower surface of the substrate 50. In addition,the second detection signal wiring 575 c includes a portion 575 dextending in the Y axis direction in parallel with the portion 573 d onthe third portion 53.

The fixed potential wiring 574 c couples the first fixed potentialterminal 574 a and the second fixed potential terminal 576 a, and thefirst fixed potential terminal 574 b and the second fixed potentialterminal 576 b. The fixed potential wiring 574 c is led from above thethird portion 53 onto the first portion 51 via upper sides of the secondbeam portion 55, the second portion 52, and the first beam portion 54.Here, the fixed potential wiring 574 c is disposed so as to be separatedfrom the other wiring and terminal described above and fill a gapbetween the other wiring and the terminal. For this reason, the fixedpotential wiring 574 c is disposed over an entire area of a lowersurface of the third portion 53. Accordingly, it is possible to shield anoise from the package 2 or the circuit element 4 to the sensor element3 by the fixed potential wiring 574 c. The fixed potential wiring 574 cis electrically coupled to a fixed potential, for example, a groundpotential.

A component material of the electrode pattern 57 is not particularlylimited as long as the component material has conductivity. For example,the electrode pattern 57 can be configured by a metal film, on whicheach of films such as Ni (nickel), Au (gold), Ag (silver), Cu (copper),and the like is laminated, with a metallization layer of Cr (chromium),W (tungsten), or the like as an underlayer. The shapes of the wires andthe terminals included in the electrode pattern 57 are not limited tothe illustrated shapes.

The package 2 is joined to the first portion 51 of the relay substrate 5described above via the joining material 62 illustrated in FIG. 2, andthe sensor element 3 is joined to the third portion 53 of the relaysubstrate 5 via the joining material 61 illustrated in FIG. 2. In thismanner, by joining the package 2 and the sensor element 3 to thesubstrate 50 in a gimbal shape, it is possible to effectively reduce astress being transmitted from the package 2 to the sensor element 3.

In a state in which the sensor element 3 is mounted on the relaysubstrate 5, as illustrated in FIG. 12, the drive signal wiring 371 c ofthe sensor element 3 intersects with both of the portion 573 d of thefirst detection signal wiring 573 c and the portion 575 d of the seconddetection signal wiring 575 c of the relay substrate 5 when seen in theZ axis direction. Accordingly, it is possible to reduce a differencebetween a quantity of a noise mixed from the drive signal wiring 371 cwith the first detection signal wiring 573 c and a quantity of a noisemixed from the drive signal wiring 371 c with the second detectionsignal wiring 575 c. Here, the drive signal wiring 371 c extends alongthe X axis direction, whereas the first detection signal wiring 573 cand the second detection signal wiring 575 c extend along the Y axisdirection. For this reason, even when a position or a posture of thesensor element 3 slightly deviates from a predetermined position or apredetermined posture, it is possible to reduce a change in a differenceof a capacity between the drive signal wiring 371 c and the firstdetection signal wiring 573 c and a capacity between the drive signalwiring 371 c and the second detection signal wiring 575 c. In view ofallowing such a deviation, a distance L3 between an end of the drivesignal wiring 371 c and the first detection signal wiring 573 c or thesecond detection signal wiring 575 c may be equal to or larger than 175μm and equal to or smaller than 600 μm or may be equal to or larger than250 μm and equal to or smaller than 550 μm.

As described above, the physical quantity sensor 1 includes the base 21,the relay substrate 5 as a supporting member supported by the base 21,and the sensor element 3 supported by the relay substrate 5. The sensorelement 3 includes the vibrator element 30 and the drive signal wiring371 c, the first detection signal terminal 373 b, and the seconddetection signal terminal 375 b disposed on the vibrator element 30.Here, the drive signal wiring 371 c transmits a drive signal forvibrating the drive arms 316, 317, 318, and 319 as a drive portion ofthe vibrator element 30 and extends along the line segment X1 as a firstaxis. The first detection signal terminal 373 b and the second detectionsignal terminal 375 b output a detection signal in accordance withvibration of the detection arms 312 and 313 as a detection portion ofthe vibrator element 30. On the other hand, the relay substrate 5includes the third portion 53 as a substrate to which the sensor element3 joined and the first detection signal wiring 573 c and the seconddetection signal wiring 575 c disposed on the third portion 53. Here,the first detection signal wiring 573 c transmits the detection signalfrom the first detection signal terminal 373 b. The second detectionsignal wiring 575 c transmits the detection signal from the seconddetection signal terminal 375 b.

The first detection signal wiring 573 c and the second detection signalwiring 575 c include the portions 573 d and 575 d intersecting with thedrive signal wiring 371 c side by side in a width direction, that is, adirection orthogonal to the second axis along the Y axis as the secondaxis intersecting with the line segment X1 when seen in a plan view inthe Z axis direction which is a direction in which the sensor element 3and the third portion 53 are disposed in a line.

According to the physical quantity sensor 1, by interposing the relaysubstrate 5 between the package 2 and the sensor element 3, it ispossible to reduce transmission of a stress such as a thermal stressfrom the package 2 to the sensor element 3. As a result, it is possibleto improve detection accuracy of the physical quantity sensor 1.

In addition, since the first detection signal wiring 573 c and thesecond detection signal wiring 575 c of the relay substrate 5 includethe portions intersecting with the drive signal wiring 371 c of thesensor element 3 side by side in the width direction in a plan view,that is, the portions 573 d and 575 d closely facing each other, it ispossible to reduce the difference (hereinafter, also simply referred toas “capacitance difference”) of the capacity between the drive signalwiring 371 c and the first detection signal wiring 573 c and thecapacity between the drive signal wiring 371 c and the second detectionsignal wiring 575 c. Further, even when a positional deviation occurswhen the sensor element 3 is installed on the relay substrate 5, it ispossible to reduce a change in the capacitance difference due to thepositional deviation. Therefore, it is possible to reduce a differencebetween a quantity of a noise mixed from the drive signal wiring 371 cwith the first detection signal wiring 573 c and a quantity of a noisemixed from the drive signal wiring 371 c with the second detectionsignal wiring 575 c. For this reason, by differentially amplifying thefirst detection signal and the second detection signal, it is possibleto cancel out or reduce these noises. As a result, it is possible toprovide the physical quantity sensor 1 with high sensibility.

Here, in a plan view, the portions 573 d and 575 d are positioned closerto a center of the relay substrate 5 than an outer edge of the thirdportion 53. Accordingly, even when the positional deviation occurringwhen the sensor element 3 is installed on the relay substrate 5 isrelatively large, it is possible to reduce a change in an area in whichthe first detection signal wiring 573 c and the second detection signalwiring 575 c in a plan view, and the drive signal wiring 371 c overlapwith each other, and as a result, it is possible to reduce a change in acapacitance difference due to the positional deviation. On the otherhand, in a case where the portions 573 d and 575 d are positioned closerto the outer edge than the center of the third portion 53, if thepositional deviation occurring when the sensor element 3 is installed onthe relay substrate 5 occurs, the area in which the first detectionsignal wiring 573 c and the second detection signal wiring 575 c, andthe drive signal wiring 371 c overlap with each other in a plan viewchanges or even if the area does not change, a fringe capacitance occursbetween one detection signal wiring and the outer edge of the sensorelement 3, so that the capacitance difference tends to change.

The relay substrate 5 as a supporting member of the present embodimentincludes the first portion 51 in a frame shape, the second portion 52 ina frame shape disposed inside the first portion 51, the third portion 53as a substrate disposed inside the second portion 52, the first beamportion 54 which swingably supports the second portion 52 around theaxis a1 as a third axis from the first portion 51, and the second beamportion 55 which swingably supports the third portion 53 around the axisa2 as a fourth axis intersecting with the axis a1 from the secondportion 52. The first portion 51 is joined to the base 21 and the sensorelement 3 is joined to the third portion 53. By using the relaysubstrate 5 with this configuration, it is possible to reduce a stresstransmitted from the base 21 to the sensor element 3 via the relaysubstrate 5. In addition, it is possible to improve impact resistance ofthe physical quantity sensor 1.

As illustrated in FIG. 13 described above, the relay substrate 5 mayhave a configuration in which the second beam portion 55 is omitted.That is, the relay substrate 5 as a supporting member may be configuredto include the first portion 51 in a frame shape joined to the base 21,the third portion 53 as a substrate disposed inside the first portion51, and the first beam portion 54 which swingably supports the thirdportion 53 around the axis a1 as a third axis from the first portion 51.Also in this configuration, it is possible to reduce a stresstransmitted from the base 21 to the sensor element 3 via the relaysubstrate 5. In addition, it is possible to improve impact resistance ofthe physical quantity sensor 1.

Further, although the sensor element 3 and the relay substrate 5 arejoined via the joining material 61, the joining material 61 may be ametal bump. That is, the physical quantity sensor 1 may include thejoining material 61 which is a metal bump joining the sensor element 3and the third portion 53 as a substrate. Accordingly, it is possible toreduce a variation in a distance between the sensor element 3 and therelay substrate 5 when the sensor element 3 is installed on the relaysubstrate 5. For this reason, it is possible to reduce a variation inthe capacitance difference described above due to the variation in thedistance.

A method of manufacturing the physical quantity sensor 1 includes a stepof preparing the base 21, the relay substrate 5, and the sensor element3 and a step of joining the relay substrate 5 and the sensor element 3.According to the method of manufacturing the physical quantity sensor 1,it is possible to provide the physical quantity sensor 1 with highsensitivity.

1b. Second Embodiment

FIG. 14 is a plan view of an electrode pattern of a sensor elementaccording to the second embodiment when seen from the +Z axis directionside. FIG. 15 is a plan view of the electrode pattern of the sensorelement illustrated in FIG. 14 when seen from the −Z axis directionside. FIG. 16 is a diagram illustrating a coupling state between a firstdetection signal wiring and a second detection signal wiring, and acharge amplifier according to the second embodiment. FIG. 17 is anenlarged plan view illustrating a drive signal wiring, and the firstdetection signal wiring and the second detection signal wiring of thesensor element illustrated in FIG. 14. FIG. 18 is a plan view of anelectrode pattern of a relay substrate according to the secondembodiment when seen from the +Z axis direction side.

The present embodiment is the same as the first embodiment describedabove except that shapes of the electrode pattern of the sensor elementand the relay substrate are different. In the following description, forthe second embodiment, a difference from the first embodiment will bemainly described, and the same items are denoted by the same referencenumerals, and description thereof will be not repeated.

As illustrated in FIGS. 14 and 15, a sensor element 3A according to thepresent embodiment includes the vibrator element 30 and an electrodepattern 37A provided on a surface of the vibrator element 30.

In the electrode pattern 37A, the first detection signal electrode 373 ais provided on the upper and lower surfaces of the arm portion of thedetection arm 312 and both side surfaces of the arm portion of thedetection arm 313, and outputs a charge generated by detection vibrationof the detection arms 312 and 313 as a first detection signal. Here, asillustrated in FIG. 15, the first detection signal electrode 373 aprovided on the detection arm 313 is coupled to a first detection signalterminal 373 e via a first detection signal wiring 373 f. The firstdetection signal terminal 373 e is provided on the lower surface of thesupporting portion 322. In addition, the first detection signal wiring373 f is led from above the base portion 311 onto the supporting portion322 via an upper side of the beam portion 325.

Further, the second detection signal electrode 375 a is provided on bothside surfaces of the arm portion of the detection arm 312 and the upperand lower surfaces of the arm portion of the detection arm 313, andoutputs a charge generated by detection vibration of the detection arms312 and 313 as a second detection signal. Here, as illustrated in FIG.15, the second detection signal electrode 375 a provided on thedetection arm 312 is coupled to a second detection signal terminal 375 evia a second detection signal wiring 375 f. The second detection signalterminal 375 e is provided on the lower surface of the supportingportion 321. In addition, the second detection signal wiring 375 f isled from above the base portion 311 onto the supporting portion 321 viaan upper side of the beam portion 323.

In this manner, in the present embodiment, the first detection signalwiring 373 c and the second detection signal wiring 375 f are withdrawnfrom above the detection arm 312 (first detection arm) onto the baseportion 311 and the first detection signal wiring 373 f and the seconddetection signal wiring 375 c are withdrawn from above the detection arm313 (second detection arm) onto the base portion 311. For example, asillustrated in FIG. 16, the first detection signal wirings 373 c and 373f are respectively coupled to the charge amplifier 451 and the seconddetection signal wirings 375 c and 375 f are respectively coupled to thecharge amplifier 452. Accordingly, it is possible to obtain the firstdetection signal and the second detection signal which are twice as muchas a charge quantity of the first embodiment described above. For thisreason, it is possible to improve detection sensitivity of the sensorelement 3A.

In the present embodiment, as illustrated in FIG. 17, the width W1 whichis a length of the first detection signal wiring 373 c in the Y axisdirection is larger than the width W2 which is a length of the seconddetection signal wiring 375 c in the Y axis direction. Accordingly, thedistance L1 between the constant width portion of the drive signalwiring 371 c and the first detection signal wiring 373 c becomes smallerthan the distance L2 between the constant width portion of the drivesignal wiring 371 c and the second detection signal wiring 375 c. Forthis reason, it is possible to reduce a difference between the firstcapacity and the second capacity.

In addition to this, the first detection signal wiring 373 c is longertoward a −X axis direction side by a length L5 so as to approach aportion (also referred to as a “withdrawn portion”) drawn to a sidesurface of the base portion 311 of the drive signal wiring 371 c.Accordingly, a difference between a distance L4 which is a minimumseparation distance between a withdrawn portion of the drive signalwiring 371 c and the first detection signal wiring 373 c and a distanceL6 which is a minimum separation distance between a withdrawn portion ofthe drive signal wiring 371 c and the second detection signal electrode375 a becomes small. Accordingly, even in the wiring disposition as inthe present embodiment, it is possible to extremely reduce thedifference between the first capacitance and the second capacitance.

As illustrated in FIG. 18, a relay substrate 5A according to the presentembodiment includes the substrate 50 and an electrode pattern 57Aprovided on the substrate 50.

In the electrode pattern 57A, a first detection signal terminal 573 eand a second detection signal terminal 575 e are disposed on the uppersurface of the third portion 53 of the substrate 50. The first detectionsignal terminal 573 e is provided corresponding to the first detectionsignal terminal 373 e of the sensor element 3A described above and iscoupled to the first detection signal wiring 573 c having a portion 573f. The second detection signal terminal 575 e is provided correspondingto the second detection signal terminal 375 e of the sensor element 3Adescribed above and is coupled to the second detection signal wiring 575c having a portion 575 f.

In a state in which the sensor element 3A is mounted on the relaysubstrate 5A, the drive signal wiring 371 c of the sensor element 3Aintersects with both of the portion 573 f of the first detection signalwiring 573 c and the portion 575 f of the second detection signal wiring575 c of the relay substrate 5A when seen in the Z axis direction.Accordingly, it is possible to reduce a difference between a quantity ofa noise mixed from the drive signal wiring 371 c with the firstdetection signal wiring 573 c and a quantity of a noise mixed from thedrive signal wiring 371 c with the second detection signal wiring 575 c.

According to the second embodiment as described above, the same effectsas the first embodiment described above can be also obtained.

1c. Third Embodiment

FIG. 19 is an enlarged plan view illustrating a drive signal wiring, anda first detection signal wiring and a second detection signal wiring ofa sensor element according to the third embodiment. FIG. 20 is a graphillustrating a relationship between a removed width L7 and a capacitancedifference illustrated in FIG. 19.

The present embodiment is the same as the first embodiment describedabove except that a shape of the second fixed potential wiring of thesensor element is different. In the following description, for the thirdembodiment, a difference from the first embodiment will be mainlydescribed, and the same items are denoted by the same referencenumerals, and description thereof will be not repeated.

In the present embodiment, as illustrated in FIG. 19, a part of thesecond fixed potential wiring 376 c is removed on the base portion 311.Accordingly, it is possible to adjust the difference between the firstcapacity and the second capacity by decreasing an electromagneticshielding property of the second fixed potential wiring 376 c than thefirst fixed potential wiring 374 c.

In this manner, in the present embodiment, also if lengths of the firstportion at which the first fixed potential wiring 374 c is positionedbetween the drive signal wiring 371 c and the first detection signalwiring 373 c on the base portion 311 and the second portion in which thesecond fixed potential wiring 376 c is positioned between the drivesignal wiring 371 c and the second detection signal wiring 375 c on thebase portion 311 are different from each other, it is possible to adjustthe difference between the first capacity and the second capacity.

Here, as illustrated in FIG. 20, the difference between the firstcapacitance and the second capacitance changes according to a length L7of a removed portion of the second fixed potential wiring 376 c in the Xaxis direction, that is, a removal width. Therefore, the length L7 maybe adjusted so that the difference between the first capacitance and thesecond capacitance becomes small. “Capacity difference ratio” on thevertical axis in FIG. 20 is a value normalized with a value of thecapacitance difference as a reference when the length L7 is 0.

According to the third embodiment as described above, the same effectsas the first embodiment described above can be also obtained.

2. Electronic Apparatus

FIG. 21 is a perspective view illustrating a configuration of a mobiletype or a notebook type personal computer which is an electronicapparatus according to the embodiment.

In FIG. 21, a personal computer 1100 is configured to include a mainbody portion 1104 having a keyboard 1102 and a display unit 1106 havinga display unit 1108, and the display unit 1106 is pivotably supportedfrom the main body portion 1104 via a hinge structure portion. In thepersonal computer 1100, the physical quantity sensor 1 is mounted.

FIG. 22 is a perspective view illustrating a configuration of a mobilephone which is an electronic apparatus according to the embodiment.

In FIG. 22, a mobile phone 1200 includes an antenna (not illustrated), aplurality of operation buttons 1202, an earpiece 1204, and a mouthpiece1206. A display unit 1208 is disposed between the operation button 1202and the earpiece 1204. In the mobile phone 1200, the physical quantitysensor is mounted.

FIG. 23 is a perspective view illustrating a configuration of a digitalstill camera which is an electronic apparatus according to theembodiment.

A digital still camera 1300 is configured to include a display unit 1310provided on a rear surface of a case 1302 of the digital still camera1300 and to perform display based on an imaging signal by a CCD. Thedisplay unit 1310 functions as a viewfinder which displays a subject asan electronic image. In addition, a light receiving unit 1304 includingan optical imaging system such as an optical lens or the like, the CCD,and the like is provided on a rear surface side of the case 1302 in FIG.23. When a photographer confirms a subject image displayed on thedisplay unit 1310 and presses a shutter button 1306, an imaging signalof the CCD at that time is transmitted and stored to and in a memory1308. In the digital still camera 1300, the physical quantity sensor 1is mounted.

The electronic apparatus as described above includes the physicalquantity sensor 1 according to the first to third embodiments describedabove. Here, as described above, the physical quantity sensor 1 includesthe sensor element 3 or 3A and the circuit element 4 as a controlcircuit which outputs a drive signal to the sensor element 3 or 3A andto which a detection signal is input. According to the electronicapparatus as described above, it is possible to improve a property ofthe electronic apparatus by using a detection result of the sensorelement 3 or 3A or the physical quantity sensor 1 with high sensibility.

The electronic apparatus according to the present application examplecan be applied to, for example, a smartphone, a tablet terminal, atimepiece such as smart watch, an ink jet type ejecting apparatus suchas an ink jet printer, a laptop type personal computer, a television, awearable terminal such as an HMD (head mounted display), a video camera,a video tape recorder, a car navigation device, a pager, an electronicdiary (including a communication function), an electronic dictionary, anelectronic calculator, an electronic game apparatus, a word processor, awork station, a video phone, a security monitor for television, a pairof electronic binoculars, a POS terminal, a medical apparatus (forexample, an electronic thermometer, a sphygmomanometer, a blood glucosemonitoring device, an electrocardiogram measuring device, an ultrasonicdiagnostic device, an electronic endoscope), a fish finder, variousmeasuring instruments, an apparatus for a vehicle terminal base station,an instrument (for example, an instrument of a vehicle, an aircraft, ora ship), a flight simulator, a network server, and the like in additionto the personal computer in FIG. 21, the mobile phone in FIG. 22, andthe digital still camera in FIG. 23.

3. Vehicle

FIG. 24 is a perspective view illustrating an automobile which is avehicle according to the embodiment.

In FIG. 24, an automobile 1500 includes a vehicle body 1501 which is abody and four wheels 1503, and is configured to rotate the wheel 1503 bya power source such as an engine (not illustrated) provided in thevehicle body 1501.

In the vehicle body 1501 of the automobile 1500, the physical quantitysensor 1 is mounted. According to the physical quantity sensor 1, it ispossible to detect a posture or a moving direction of the vehicle body1501. A detection signal of the physical quantity sensor 1 is suppliedto a vehicle body posture control device 1502. By detecting a posture ofthe vehicle body 1501 based on the signal, the vehicle body posturecontrol device 1502 can control a hardness of a suspension according tothe detection result or can control a brake of the individual wheels1503.

The vehicle including the physical quantity sensor 1 is not limited tothe automobile, but can also be applied to, for example, another vehiclesuch as a motorcycle, a railroad, an aircraft, a ship, a spacecraft, abiped walking robot, a radio control helicopter, or the like.

As described above, the automobile 1500 which is a vehicle includes thephysical quantity sensor 1 according to the first to third embodimentsdescribed above. Here, as described above, the physical quantity sensor1 includes the sensor element 3 or 3A and the circuit element 4 as acontrol circuit which outputs a drive signal to the sensor element 3 or3A and to which a detection signal is input. According to the automobile1500 as described above, it is possible to improve a property of theautomobile 1500 by using a detection result of the sensor element 3 or3A or the physical quantity sensor 1 with high sensibility.

Hereinbefore, the physical quantity sensor, the method of manufacturingthe physical quantity sensor, the electronic apparatus, and the vehicleaccording to the present disclosure are described based on theembodiments illustrated in the accompanying drawings, but the presentdisclosure is not limited thereto and the configuration of each of theportions can be replaced with any configuration having the samefunction. Further, any other component may be added to the presentdisclosure. In addition, each of the embodiments may be appropriatelycombined.

In the embodiment described above, the example in which the vibratorelement of the sensor element has a double T type is described, but thesensor element may be a vibrator element in which the drive signalwiring, the first detection signal terminal, and the second detectionsignal terminal are provided and is not limited to a double T type ofvibrator element. For example, the present disclosure also can beapplied to an H type or a tuning fork type vibrator element.

In addition, in the embodiment described above, the example in which therelay substrate is directly coupled to the package is described, but thepresent disclosure is not limited thereto. For example, the relaysubstrate may be coupled to the package via the circuit element.

What is claimed is:
 1. A physical quantity sensor comprising: a base; asupporting member supported by the base; and a sensor element supportedby the supporting member, wherein the sensor element includes a vibratorelement having a pair of drive arms and a pair of detection arms, adrive signal wiring that is disposed on the vibrator element, thattransmits a drive signal for vibrating a drive portion of the vibratorelement, and that extends along a first axis, and a first detectionsignal terminal and a second detection signal terminal that are disposedon the pair of detection arms and that output detection signals inaccordance with vibration of the pair of detection arms, the supportingmember includes a substrate on which the sensor element is joined, afirst detection signal wiring that is disposed on the substrate and thattransmits the detection signal from the first detection signal terminal,a second detection signal wiring that is disposed on the substrate andthat transmits the detection signal from the second detection signalterminal, a first portion in a frame shape joined to the base, thesubstrate to which the sensor element is joined and which is disposedinside the first portion, and a first beam portion swingably supportingthe substrate around a third axis with respect to the first portion, andthe first detection signal wiring and the second detection signal wiringrespectively include areas that extend along a second axis intersectingwith the first axis and that intersect with the drive signal wiring in aplan view as seen in a direction in which the sensor element and thesubstrate overlap with each other.
 2. The physical quantity sensoraccording to claim 1, wherein the area of the first detection signalwiring that extends along the second axis and that intersects with thedrive signal wiring in a plan view is positioned closer to a center ofthe substrate than an outer edge of the substrate in the plan view. 3.The physical quantity sensor according to claim 1, wherein thesupporting member includes a second portion in a frame shape disposedinside the first portion, the substrate to which the sensor element isjoined and which is disposed inside the second portion, the first beamportion swingably supporting the second portion around the third axiswith respect to the first portion, and a second beam portion swingablysupporting the substrate around a fourth axis intersecting with thethird axis with respect to the second portion.
 4. The physical quantitysensor according to claim 1, further comprising: a metal bump joiningthe sensor element and the substrate.
 5. A method of manufacturing aphysical quantity sensor having a base, a supporting member supported bythe base, and a sensor element supported by the supporting member, themethod comprising: preparing the base, the supporting member, and thesensor element; and joining the supporting member and the sensorelement, wherein in the preparing, the sensor element includes avibrator element having a pair of drive arms and a pair of detectionarms, a drive signal wiring that is disposed on the vibrator element,that transmits a drive signal for vibrating a drive portion of thevibrator element, and that extends along a first axis, and a firstdetection signal terminal and a second detection signal terminal thatare disposed on the pair of detection arms and that output detectionsignals in accordance with vibration of the pair of detection arms, thesupporting member includes a substrate, a first detection signal wiringthat is disposed on the substrate and that transmits the detectionsignal from the first detection signal terminal, a second detectionsignal wiring that is disposed on the substrate and that transmits thedetection signal from the second detection signal terminal, a firstportion in a frame shape joined to the base, the substrate to which thesensor element is joined and which is disposed inside the first portion,and a first beam portion swingably supporting the substrate around athird axis with respect to the first portion, and in the joining, thefirst detection signal wiring and the second detection signal wiringrespectively include areas that extend along a second axis intersectingwith the first axis and that intersect with the drive signal wiring in aplan view as seen in a direction in which the sensor element and thesubstrate overlap with each other.
 6. An electronic apparatuscomprising: the physical quantity sensor according to claim 1, whereinthe physical quantity sensor includes a circuit element.
 7. A vehiclecomprising: the physical quantity sensor according to claim 1; and abody on which the physical quantity sensor is mounted.